| abstract |
The present invention addresses the problem of providing an electroconductive pattern which has such a high level of adhesion that an electroconductive layer comprising an electroconductive substance such as silver, etc. does not peel off from a primer layer over time. An electroconductive pattern according to the present invention, wherein an electroconductive layer (A) that comprises a compound (a1) having a basic nitrogen atom-containing group and an electroconductive substance (a2), a primer layer (B) that comprises a compound (b1) containing a functional group [X], and a supporting layer (C) are stacked, is characterized in that the basic nitrogen atom-containing group of the compound (a1) in the electroconductive layer (A) is reacted with the functional group [X] of the compound (b1) in the primer layer (B) to thereby form a bond. |