| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-241 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2053 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 |
| filingDate |
2013-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d095f7025e23852a2284a61e95a83c45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_050f6e49c593c0ce06c128956e664739
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c55684f6ed92421baec80df11295f11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02e3c47bb849a12de953190b90a3b68c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7589d20db2a0fa976193d631b3adff8 |
| publicationDate |
2015-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20150058097-A |
| titleOfInvention |
Electrically conductive material and method for producing same |
| abstract |
Provided is a method for producing a conductive material which does not require bonding by an adhesive and which has a conductive layer of an appropriate thickness without using a vacuum facility. The present invention relates to a method for producing a metal fine particle (1) comprising at least one metal fine particle (2) selected from the group consisting of gold, silver, copper and platinum protected with a compound having a nitrogen atom, a sulfur atom, (1) to a non-conductive layer (3), and a step of forming a conductive layer by performing electroless plating on the substrate (1) having the non-conductive layer (3) Of the conductive material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10537021-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10244624-B2 |
| priorityDate |
2012-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |