http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005235533-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
filingDate 2004-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3dcfbc73154d8d601ae40311f9f459a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9730d00988000c5fded79e562a52da6
publicationDate 2005-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2005235533-A
titleOfInvention Metal particle dispersion and circuit pattern forming method using the same
abstract Dispersion stability in which metal particles used in a colloidal dispersion used for pattern formation of a conductive portion represented by circuit wiring and conductive pad formation in the electronics field do not cause separation / sedimentation due to aggregation or the like An excellent colloidal metal particle dispersion is provided. A colloidal metal particle dispersion containing metal particles having a maximum particle size of 5 nm or more and 100 nm or less, a dispersant, a polymer resin and a solvent, wherein the polymer resin is water or water and a water-soluble organic solvent. The colloidal metal particle dispersion is characterized in that it is soluble in a mixed solvent of and water, or a mixed solvent of water and a water-soluble organic solvent. The metal particle dispersion is patterned on a substrate and baked at a temperature of 80 ° C. or higher and 1500 ° C. or lower to form a circuit pattern. [Selection figure] None
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010139341-A
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