Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dab471719da712fccaae84fe87288787 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
filingDate |
2008-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cac9df5ae089f20da51dcf295fa40232 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8c971a931f081a80d95a2cbc052a98e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30b5b546e5030ea083421b7a93621ff4 |
publicationDate |
2009-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2009275146-A |
titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
abstract |
The present invention provides an epoxy resin composition for encapsulating a semiconductor capable of reducing the amount of shrinkage of a cured epoxy resin composition as a sealing material and suppressing the occurrence of warping of a package. An epoxy resin composition for semiconductor encapsulation containing the following components (A) to (D). (A) Epoxy resin. (B) Curing agent. (C) Inorganic filler. (D) Spherical silicone powder. [Selection figure] None |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019054066-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190132240-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013203865-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200130372-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017119767-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7163569-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019060235-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013023661-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011168634-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015121012-A |
priorityDate |
2008-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |