http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009275146-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
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filingDate 2008-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cac9df5ae089f20da51dcf295fa40232
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publicationDate 2009-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009275146-A
titleOfInvention Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
abstract The present invention provides an epoxy resin composition for encapsulating a semiconductor capable of reducing the amount of shrinkage of a cured epoxy resin composition as a sealing material and suppressing the occurrence of warping of a package. An epoxy resin composition for semiconductor encapsulation containing the following components (A) to (D). (A) Epoxy resin. (B) Curing agent. (C) Inorganic filler. (D) Spherical silicone powder. [Selection figure] None
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Total number of triples: 54.