| abstract |
An epoxy resin composition for semiconductor encapsulation having excellent fluidity and temperature cycle resistance. A rubber having a core-shell structure comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) a butadiene rubber for the core and a polymethacrylic acid ester for the shell. An epoxy resin for semiconductor encapsulation, wherein the primary particles of the rubber particles have an average particle diameter of 15 to 500 nm, and the rubber particles have an acetone-insoluble content of 5 to 28% by weight. Composition. |