| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 |
| filingDate |
2010-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a558e68c5ad5b4972f420d66b5bfba79
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6bf53967173c789f14e1618c98722a6e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd1011a500dbb41e83d3d2abce4b4de2 |
| publicationDate |
2011-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2011168634-A |
| titleOfInvention |
Epoxy resin composition and semiconductor device |
| abstract |
To provide a highly reliable epoxy resin composition and a semiconductor device which do not peel off from a semiconductor element or a substrate and do not foam even when placed under vacuum. SOLUTION: (A) epoxy resin: 100 parts by mass, (B) amine-based curing agent: [molar amount of epoxy group in component (A) / group having reactivity with epoxy group in component (B) Molar amount] is 0.7 to 1.2, (C) inorganic filler having an average particle size of 0.1 to 2 μm and a maximum particle size of 24 μm or less: 50 to 300 parts by mass, and (D) average Silicone fine particles having a particle size of 0.1 to 10 μm and a maximum particle size of 24 μm or less, and a silicone rubber spherical fine particle coated with a polyorganosilsesquioxane resin: an epoxy resin having 1 to 20 parts by mass as an essential component An epoxy resin composition characterized in that the amount of reduction after heating at 100 ° C. for 30 minutes under a reduced pressure of 100 to 200 Pa is 3% by mass or less and the surface tension is 25 mN / m or more. . [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018172546-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210108991-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015232146-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7000698-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017030299-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7346804-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007277578-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019124418-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022138346-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022085522-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020137913-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019189394-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017171727-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015225913-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013082782-A |
| priorityDate |
2010-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |