| abstract |
PROBLEM TO BE SOLVED: To provide a printed wiring board having high flame retardancy without using a halogen compound, phosphorus compound or hydrated metal oxide, excellent chemical resistance, high glass transition temperature, and excellent solder heat resistance. A material prepreg and a laminate are provided. SOLUTION: A halogen-free flame-retardant resin composition, a prepreg, and a laminate obtained by blending a naphthol aralkyl-type cyanate ester resin and a non-halogen epoxy resin with a maleimide compound, silicone powder, and a silicate compound. High flame retardancy can be maintained with silicone powder alone, and it has excellent chemical and heat resistance. [Selection figure] None |