| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31529
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24355 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate |
2013-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d23bbea45aa676bf05607b9d5afbf256
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9f8390be15a377ff8c23201fcd2cbb1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_feb3f68f6e46618d1aaa667781d3d81e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82b46b4be8ca4480c3419df377d0beb1 |
| publicationDate |
2014-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140128309-A |
| titleOfInvention |
Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using same |
| abstract |
It is possible to form a low-coarseness surface on the surface of the insulating layer irrespective of the harmonic conditions and to improve the adhesion between the insulating layer and the plated-through conductor layer and to improve the thermal expansion coefficient (linear expansion coefficient) A resin composition having a low glass transition temperature and a high moisture absorption and heat resistance is provided. A resin composition comprising an epoxy compound (A), a cyanate ester compound (B) and an inorganic filler (C), wherein the cyanate ester compound (B) is a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanide (A) and the cyanate ester compound (B) is at least one selected from the group consisting of an acid ester compound, a biphenylaralkyl type cyanate ester compound and a novolak type cyanate ester compound, , The content of the epoxy compound (A) is 60 to 75% by mass. |
| priorityDate |
2012-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |