| abstract |
assignment Provided is a resin composition having a low thermal expansion coefficient in the surface direction of the cured resin and excellent heat resistance and flame retardancy while maintaining the content of the inorganic filler at the same level as a conventional resin. Solution A resin composition comprising an epoxy resin (A), a maleimide compound (B), a curing agent (C), and an inorganic filler (D), wherein the epoxy resin (A) is represented by the following formula (I) Shall be [Formula 1] |