| abstract |
A novel positive resist material using a low molecular material as a substrate component and a resist pattern forming method using the positive resist material are provided. The following general formula (b1) [wherein X is an optionally substituted hydrocarbon group having 3 to 30 carbon atoms, and Q 1 is a divalent linking group containing an oxygen atom. Y 1 is an optionally substituted alkylene group having 1 to 4 carbon atoms or a fluorinated alkylene group having 1 to 4 carbon atoms which may have a substituent, and A + is an acid dissociation An organic cation having a soluble dissolution inhibiting group. And a base component (B) composed of the compound (B1) represented by formula (B1) as a main component. [Chemical 1] [Selection figure] None |