| abstract |
The present invention provides an alkaline composition useful for the microelectronics industry for stripping or cleaning semiconductor wafer substrates by removing photoresist residues and other unwanted contamination. The composition comprises (a) one or more bases, and (b) one or more formulas: W z MX y , where M is Si, Ge, Sn, Pt, P, A metal selected from the group consisting of B, Au, Ir, Os, Cr, Ti, Zr, Rh, Ru and Sb; X is a halide selected from the group consisting of F, Cl, Br and I Yes; W is selected from H, alkali or alkaline earth metal and metal ion-free hydroxide base moieties; y is a number from 4 to 6 depending on the metal halide; and z is 1 Metal corrosion-inhibiting metal halide compounds having a number of 2 or 3. |