| abstract |
A positive resist composition having improved contact hole sensitivity, excellent resolving power and pattern profile shape, improved line width variation due to holding time in a vacuum chamber of an irradiation apparatus, and improved dissolution contrast, and the same The pattern forming method used is provided. (A) A resin having a repeating unit having a specific group, decomposed by the action of an acid to increase the solubility in an alkaline developer, and (B) a cationic part having at least one carboxyl group A positive resist composition comprising a compound having an anion portion of a structure and generating an acid by the action of actinic rays or radiation, and a pattern forming method using the same. [Selection figure] None |