http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004219536-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 |
| filingDate | 2003-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20f6fd73333c52530dd0b90822965895 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd3e4d4c821071b77759bc69cb1e3009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50e989cbff6111913a6eef9ca62945b8 |
| publicationDate | 2004-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004219536-A |
| titleOfInvention | Photosensitive resin composition, substrate for circuit formation, method for producing resist pattern, method for producing printed wiring board |
| abstract | An object of the present invention is to form a resist thicker than the thickness of wiring plating, to have no chipping or cracking of the resist, to have a rectangular resist pattern, not to have a rough cross section, and to have good adhesion to a substrate. Positive photosensitive resin that has good plating solution resistance and good wettability to plating solution, and is suitable for package substrate circuit forming applications that can be easily peeled off by a stripping solution after plating, and for redistribution circuit forming on semiconductor chips. An object of the present invention is to provide a composition, a substrate for forming a circuit, a method for forming a resist pattern, and a method for manufacturing a printed wiring board. (A) an alkali-soluble novolak resin; (B) an alkali-soluble acrylic resin containing 5 to 40% by weight of a radically polymerizable unit having a carboxyl group and / or a phenolic hydroxyl group per repeating unit; and 100% by weight of a novolak resin. A positive photosensitive resin composition having a film thickness of 5 to 30 μm, containing 5 to 50% by weight of (C) a quinonediazide group-containing compound. [Selection diagram] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010015079-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8535873-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100741296-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013218269-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011095746-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101113019-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2007066661-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I410746-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007128067-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4865729-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101365768-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014156630-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007066661-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101268424-B1 |
| priorityDate | 2003-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 310.