http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2007066661-A1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0236 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
filingDate | 2006-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2009-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-WO2007066661-A1 |
titleOfInvention | Positive photoresist composition and photoresist pattern forming method using the same |
abstract | Can form a film thickness of 5 μm or more, does not generate cracks due to thermal shock even when exposed to low temperatures, has high sensitivity, and can be easily peeled off from common solvents Provided are a positive photoresist composition and a photoresist pattern forming method using the same. A positive photoresist composition comprising (A) an alkali-soluble novolak resin, (B) at least one plasticizer selected from an alkali-soluble acrylic resin and an alkali-soluble vinyl resin, and (C) a quinonediazide group-containing compound, Is a method of forming a photoresist pattern using this positive photoresist composition. |
priorityDate | 2005-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 307.