abstract |
A positive resist composition having good line edge roughness, which can be suitably used in an ultramicrolithography process such as the manufacture of VLSI and high-capacity microchips and other photofabrication processes, and further It is an object of the present invention to provide a positive resist composition excellent in resolving power, defocus latitude, and exposure margin in contact hole pattern formation. A resin whose rate of dissolution in an alkaline developer is increased by the action of an acid having a specific repeating unit, (B) a compound that generates an acid upon irradiation with actinic rays or radiation, (C) a solvent, and (D) an interface. A positive resist composition containing an activator. [Selection figure] None |