http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002261043-A

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filingDate 2001-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68c700f10ed9ae9b04dd0792e3236c3d
publicationDate 2002-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002261043-A
titleOfInvention Semiconductor device and method of manufacturing the same
abstract PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device having a fine pattern exceeding the limit of the conventional fine processing by slightly modifying an etching technique by inheriting an already established i-line exposure technique. I will provide a. A method for manufacturing a semiconductor device, comprising: forming a material to be etched on one main surface of a semiconductor substrate; A step of forming a mask pattern on the material to be etched, and a step other than the mask pattern of the material to be etched by a dry etching method using an etchant gas and a polymer deposition gas in a state where an etching suppression wall is formed on the upper side of the mask pattern. Etching the region. The material to be etched after the etching is a gate electrode or a wiring pattern.
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Total number of triples: 30.