abstract |
PROBLEM TO BE SOLVED: To impair low elasticity, heat resistance and moisture resistance required for mounting a semiconductor chip having a large difference in thermal expansion coefficient on a wiring board called an interposer such as a glass epoxy board or a flexible board. To provide an adhesive that can secure a pot life of 3 months or more at 25 ° C. SOLUTION: (1) Epoxy resin and its curing agent 10 0 parts by weight, (2) glycidyl (meth) acrylate Tg (glass transition temperature) containing 5 to 6% by weight is -10C An adhesive containing 75 to 300 parts by weight of an epoxy group-containing acrylic copolymer having a weight average molecular weight of 800,000 or more and (3) 0.1 to 20 parts by weight of a latent curing accelerator. |