http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008144160-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate | 2007-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5358f956aa40d000d46e404b05591c1b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd4f189cfac304c3273283d0a8ba8c14 |
| publicationDate | 2008-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008144160-A |
| titleOfInvention | Adhesive sheet |
| abstract | Provided is an adhesive sheet that can be affixed to a semiconductor element or a support member at a low temperature, is flexible enough to be handled at room temperature, can be cured at 120 ° C., and can exhibit a sufficient adhesive force with little warpage. To do. An adhesive sheet (thermosetting adhesive sheet) used for bonding a thin semiconductor element and a support member, wherein the adhesive sheet has a tack strength at 60 ° C. of 60 to 1000 gf and is cured at 120 ° C. for 1 hour. DSC heat generation amount A (J / g), DS ratio of the DSC heat generation amount B (J / g) of the B stage film, A / B is 0.7 to 1. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011228399-A |
| priorityDate | 2006-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 121.