http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008285655-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2008-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_142f92c8fcb0f6ffb317b93785946098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fd2a604a1e3aea119dcf83dd870c1d4 |
| publicationDate | 2008-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008285655-A |
| titleOfInvention | Sealing film and semiconductor device using the same |
| abstract | A sealing film which has a protective function and a filling property, is used for protecting and filling a semiconductor chip, and has a better filling property by controlling fluidity during filling, and a semiconductor device using the same provide. (A) A resin comprising a high molecular weight component containing a crosslinkable functional group having a weight average molecular weight of 100,000 or more and a Tg of −50 to 50 ° C., and a thermosetting component mainly composed of an epoxy resin; B) A sealing film comprising a resin layer containing a filler having an average particle diameter of 1 to 30 μm and (C) a colorant, and 50 ° C. to 100 ° C. in thermosetting viscoelasticity measurement of the B-stage film The viscosity at 10000C is 10,000 to 100,000 Pa.s. The sealing film which is s. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014179593-A |
| priorityDate | 2007-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 164.