| abstract |
(57) Abstract: (A) Liquid epoxy resin, (C) curing accelerator, (D) inorganic filler, (E) alkyl acrylate and / or alkyl methacrylate as monomer components. Having a core part having a glass transition temperature of −10 ° C. or less, a shell part having a glass transition temperature of 80 to 150 ° C., and an average particle diameter of 0.1 to 1.0. Acrylic fine particles having a core-shell structure of μm. A liquid epoxy resin composition comprising 0.5 to 20 parts by weight based on 100 parts by weight of the component (A). The liquid epoxy resin composition of the present invention has excellent adhesion to the surface of a silicon chip, especially to a photosensitive polyimide resin or a nitride film, and is particularly effective as a sealing material for a large die size semiconductor device. A semiconductor device sealed with a resin composition is very reliable. |