| abstract |
Disclosed is an adhesive for electronic components that can provide an electronic component bonded body that is excellent in coating properties when bonding electronic components and has excellent anti-contamination properties against the bonded electronic components. An adhesive for electronic parts containing a curable compound, a curing agent, inorganic fine particles, polyether-modified siloxane, and optionally an epoxy compound having various structures, and spacer particles having a CV value of 10% or less. [Selection figure] None |