| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R4-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate |
2005-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_558e0c52317aee1fe43e7448b7fc1b08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c961b4407dbabfdc610ac72f5155d59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_910cffdc349a3f72159edc3aa6561a8d |
| publicationDate |
2007-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2007056209-A |
| titleOfInvention |
Adhesive for circuit connection |
| abstract |
To provide an adhesive for circuit connection capable of improving the connection reliability between a protruding electrode of an electronic component and a wiring electrode of a circuit board when the electronic component and the circuit board are connected via an adhesive. With the goal. An adhesive for circuit connection of the present invention comprises a thermoplastic resin such as an epoxy resin as a main component. The adhesive for circuit connection 2 has a storage elastic modulus at 35 ° C. after thermosetting of 0.5 to 3.5 GPa, an average coefficient of thermal expansion from 35 ° C. to 100 ° C. of 10 to 200 ppm / ° C., and The value indicated by the product of the storage expansion coefficient and the average thermal expansion coefficient is 40 to 300. Then, the thermosetting resin is cured by performing heat and pressure treatment via the circuit connecting adhesive 2, and the wiring electrode 4 of the circuit board 1 and the protruding electrode 5 of the electronic component 3 are connected. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022000530-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180084930-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016196646-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2017090693-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102556357-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-116083018-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-116083018-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011195735-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013187242-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10186627-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10032952-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9368421-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4894920-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9660131-B2 |
| priorityDate |
2005-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |