http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001192532-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2000-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3a9da31b49e429237329ce52da6fa25 |
| publicationDate | 2001-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2001192532-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition for area mounting type semiconductor encapsulation, which has less warpage in a soldering process and is excellent in reliability such as solder resistance. (A) an epoxy resin containing at least 20% by weight in a total epoxy resin of at least one selected from the group consisting of epoxy resins represented by the general formulas (1) and (2); A phenolic resin containing 20 to 90% by weight of the phenolic resin represented by the general formula (3) in the total phenolic resin and 10 to 80% by weight of the phenolic resin represented by the general formula (4) in the total phenolic resin; An epoxy resin composition comprising a curing accelerator and (D) fused silica as essential components and used for area-mounting type semiconductor encapsulation. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005330475-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002097252-A |
| priorityDate | 2000-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.