http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2000169677-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 |
| filingDate | 1998-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3a9da31b49e429237329ce52da6fa25 |
| publicationDate | 2000-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2000169677-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Summary] [PROBLEMS] A semiconductor package for area mounting, which has less warpage at room temperature and in a soldering process, has excellent reliability such as solder resistance and temperature cycle resistance, and has excellent moldability. An epoxy resin composition for sealing and a semiconductor device sealed with the epoxy resin composition. SOLUTION: The epoxy resin represented by the general formula (1) or (2) is contained in the total epoxy resin in an amount of 20% by weight or more, and the phenol resin represented by the general formula (3) is 20 to 90% by weight in the total phenol resin. % Of the dicyclo-modified phenol resin represented by the general formula (4) in the total phenol resin. An epoxy resin composition for semiconductor encapsulation comprising from 80 to 80% by weight, comprising a curing accelerator and a fused silica powder, and a semiconductor device encapsulated by the epoxy resin composition. Embedded image Embedded image Embedded image Embedded image |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002053643-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002097252-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001192532-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102408679-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001146511-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4491884-B2 |
| priorityDate | 1998-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.