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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
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filingDate 1999-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39ef7424ff721b11dda09a52a5f8a1b
publicationDate 2001-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001040180-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract (57) [Problem] To provide an epoxy resin composition having a small warpage, a low elastic modulus, a high adhesion, an excellent solder crack resistance, and an excellent moldability at the time of soldering in an area mounting type semiconductor device. To provide. SOLUTION: A polyfunctional phenol resin (a) represented by the formula (12) is mixed with 3-tert-butyl-4,4'-dihydroxy-3 ', 5', 6-trimethylstilbene and glycidyl etherified. Epoxy resin (A), In an epoxy resin composition containing a phenol resin curing agent, an inorganic filler, and a curing accelerator represented by the formula (14) as essential components, the weight ratio (a / b) between (a) and (b) is 1 And the softening point of the epoxy resin (A) is 70 to 1 20 ° C., the equivalent ratio of the phenolic hydroxyl groups of all phenolic resin curing agents to the epoxy groups of all epoxy resins is 0.5 to 2.0, and the content of inorganic filler is equal to the total epoxy resin and total phenolic resin curing. An epoxy resin composition for semiconductor encapsulation which is 250 to 1,400 parts by weight per 100 parts by weight of the total amount of the agent. Embedded image (K is an average value and a positive number of 1 to 10)
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4491884-B2
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priorityDate 1999-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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