http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002348356-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2001-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39ef7424ff721b11dda09a52a5f8a1b |
| publicationDate | 2002-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002348356-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition having characteristics excellent in adhesion, room temperature storage, moldability, flame retardancy and solder stress resistance. (A) a phenol aralkyl type epoxy resin having a diphenylene skeleton, (B) a phenol aralkyl resin having a diphenylene skeleton, (C) an all inorganic substance, (D) Tetraphenylphosphonium as a curing accelerator Tetrakis (1-naphthoyloxy) borate is an essential component, and all inorganic substances are 87 to 94 in all epoxy resin compositions. An epoxy resin composition for encapsulating a semiconductor, which is contained in a weight percentage. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009084325-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009051880-A |
| priorityDate | 2001-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.