| abstract |
(57) Abstract: An electroless plating bath capable of forming a film to be a barrier metal layer uniformly and at a higher film formation rate than conventional wiring lines and connection holes even in finer and higher aspect ratio wirings and connection holes. A method for forming a conductive layer using the same is provided. In a step of forming a conductive film to be a barrier metal layer 31 on the inner wall of a miniaturized wiring groove (G1, G2) or a contact hole C2, after performing an activation treatment on a surface to be plated, the conductive film is formed. A first metal material that supplies a main component of a metal, a second metal material that supplies a component that imparts a barrier metal function to a conductive film, a first complexing agent of an amphoteric ion type, and a second complex that promotes a plating reaction. The conductive film is formed using an electroless plating bath containing at least an agent, a reducing agent, and a pH adjuster and having a pH adjusted from neutral to alkaline. |