http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009542911-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| filingDate | 2007-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009542911-A |
| titleOfInvention | Plating solution for electroless deposition of copper |
| abstract | The present specification discloses an electroless copper plating solution. This solution comprises an aqueous copper salt component, an aqueous cobalt salt component, a polyamine complexing agent, a chemical brightener component, a halide component, and an amount sufficient to acidify the electroless copper plating solution. pH adjusting substance. A method for preparing an electroless copper solution is also provided. Aqueous copper salt components are copper (II) sulfate, copper (II) nitrate, copper (II) chloride, copper (II) tetrafluoroborate, copper (II) acetate, copper (II) ethylenediamine sulfate, bis (ethylenediamine) It may be selected from the group consisting of copper (II) sulfate and copper (II) diethyleneamine nitrate. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014519201-A |
| priorityDate | 2006-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 113.