http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009536987-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1687 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1642 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-48 |
| filingDate | 2007-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009536987-A |
| titleOfInvention | Plating solution for electroless deposition of copper |
| abstract | 【Task】 An electroless copper plating solution is disclosed. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a triamine-based complexing agent, and an amount of acidic pH modifying material sufficient to make the electroless copper plating solution acidic. A method for preparing an electroless copper solution is also provided. [Selection figure] None |
| priorityDate | 2006-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 76.