| abstract |
PROVIDED IS A RESIST UNDERLAYER FILM COMPOSITION WHICH IS EXCELLENT IN RESISTANCE TO A BASIC HYDROGEN PEROXIDE AQUEOUS SOLUTION, IN GAP-FILLING AND PLANARIZATION CHARACTERISTICS, AND IN DRY ETCHING CHARACTERISTIC, WHEREIN THE RESIST UNDERLAYER FILM COMPOSITION IS USED FOR A MULTILAYER RESIST METHOD, COMPRISING: (A1) A POLYMER (1A) COMPRISING ONE, OR TWO OR MORE, OF A REPEATING UNIT REPRESENTED BY FOLLOWING GENERAL FORMULA (1); (A2) ONE, OR TWO OR MORE, OF A POLYPHENOL COMPOUND HAVING A FORMULA WEIGHT OF 2,000 OR LESS AND NOT HAVING A 3,4-DIHYDROXY PHENYL GROUP; AND (B) AN ORGANIC SOLVENT. |