| abstract |
A substrate plating apparatus forms anninterconnection layer on an interconnection region composed ofna fine groove and/or a fine hole defined in a substrate. Thensubstrate plating apparatus includes a plating unit for formingna plated layer on a surface of the substrate including theninterconnection region, a chemical mechanical polishing unit fornchemically mechanically polishing the substrate to remove thenplated layer from the surface of the substrate leaving a portionnof the plated layer in the interconnection region, a cleaningnunit for cleaning the substrate after the plated layer is formednor the substrate is chemically mechanically polished, a dryingnunit for drying the substrate after the substrate is cleaned,nand a substrate transfer unit for transferring the substratento and from each of the first plating unit, the first chemicalnmechanical polishing unit, the cleaning unit, and the drying unit.nThe first plating unit, the first chemical mechanical polishingnunit, the cleaning unit, the drying unit, and the substratentransfer unit being combined into a single unitary arrangement. |