| abstract |
The present invention is an electroconductive silicone composition characterized by comprising (A) an organopolysiloxane having, in the molecule, at least two groups each having a hydrosilylation-reactive carbon-carbon unsaturated bond, (B) an organohydrogenpolysiloxane having at least two SiH groups in the molecule, (C) a bis(β-diketonato)platinum complex, (D) electroconductive particles, (E) an organic peroxide, (F) a compound having an oxacyclopropane structure, and (G) a carboxylic anhydride. Provided thereby is an addition-curable electroconductive silicone composition having high electroconductivity and good adhesiveness to metals such as aluminum and copper. |