| abstract |
The conductive adhesive is obtained by blending 30 to 98% by weight of silver powder as a conductive powder in a resin for a binder in a conductive adhesive, wherein the silver powder has a tap density in which primary particles are made of flat silver powder. A conductive adhesive characterized in that the conductive adhesive contains silver powder having a lump-aggregated structure of 1.5 g / cm 3 or less in the conductive adhesive. According to the present invention, it is possible to obtain a conductive adhesive which gives a cured product excellent not only in conductivity but also in adhesiveness, heat resistance, moisture resistance, workability, heat conductivity and the like. [Selection diagram] None |