| abstract |
The present invention relates to a thermosetting adhesive suitable for use as a conductive material in the manufacture of electronic equipment, integrated circuits, semiconductor elements, passive elements, solar cells, solar modules and / or light emitting diodes. The thermosetting adhesive includes at least one thermosetting, conductive particles having an average particle size of 1 to 50 μm, and at least one metal precursor, and the metal precursor is thermosetting the thermosetting adhesive. Substantially decomposes into the corresponding metal. |