| abstract |
A reactive conductive resin capable of ensuring excellent workability, electrical conductivity, and bonding strength by generating conductive metal particles as the binder resin is cured and forming a cured product simultaneously or sequentially. A composition and a conductive adhesive using the composition are provided. A reactive conductive resin composition comprising a metal salt compound (A), a latent reduction catalyst (B), a binder (C), and a latent curing catalyst (D), the latent reduction catalyst (B) has a function of reducing the metal salt compound (A) to produce conductive metal particles when the binder (C) undergoes a curing reaction by heat, light, or ultraviolet rays, and has a function of generating conductive metal particles. Provided by a resin composition or the like. [Selection figure] None |