Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-023 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 |
filingDate |
2014-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2015-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20150036709-A |
titleOfInvention |
Curable composition for electronic component and connection structure |
abstract |
The present invention provides a curable composition for electronic parts that can be rapidly cured and can further enhance storage stability. The curable composition for an electronic component according to the present invention comprises an epoxy compound, an anion curing agent, a flux, and a basic compound excluding the anion curing agent. |
priorityDate |
2013-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |