| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d4ada69388e0a1b68daaf536597c732 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-54 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5419 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5419
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 |
| filingDate |
2001-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_412021e8fcd70a639e26cba5270e26d2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_921f902b8f507bd3fa4cb4bfd61d72f7 |
| publicationDate |
2002-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002088337-A |
| titleOfInvention |
Silicone composition and conductive silicone adhesive formed therefrom |
| abstract |
PROBLEM TO BE SOLVED: To provide a silicone composition for preparing a silicone adhesive having particularly excellent conductivity. An organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; at least two silicon-bonded averages per molecule, sufficient to cure the composition. An organohydrogenpolysiloxane containing hydrogen atoms; a conductive filler in an amount sufficient to impart conductivity to the silicone adhesive (the filler may be silver, gold, platinum, palladium, And particles having at least the outer surface of a metal selected from alloys thereof; an effective amount of a hydroxy-functional organic compound having a molecular weight of up to 1000 and containing at least one hydroxyl group per molecule, A composition is prepared that does not contain an acetylenic hydroxyl group and assumes that the compound does not substantially inhibit the cure of the composition; and a catalytic amount of a hydrosilylation catalyst. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017534721-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4544592-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007217686-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022196410-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004027087-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002155261-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013536305-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10954422-B2 |
| priorityDate |
2000-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |