| abstract |
The present invention provides a polishing composition which is capable of polishing an object to be polished, with high polishing speed, and few scratches (defects). The present invention relates to a polishing composition which includes silica and a dispersion medium, wherein the relaxation speed ratio (R 2sp ) obtained by formula 1 (with the caveat that, R (silica) represents the reciprocal (in millisecond units) of the relaxation time of the silica, and R( medium ) represents the reciprocal (in millisecond units) of the relaxation time of the dispersion medium), as measured using pulse nuclear magnetic resonance (NMR), is in the range of 1.60-4.20 inclusive. |