abstract |
[Problem] To provide a polishing composition capable of suppressing the occurrence of defects by use in CMP polishing. [Solutions] For polishing containing silica particles, a basic nitrogen-containing organic compound, and water as a solvent, and the Rsp value expressed by the following formula (1) calculated from the measured values of pulse NMR exceeds 0.7 and is 6 or less composition. Rsp=(Rav-Rb)/(Rb)...(1) (in formula (1), Rsp is an index indicating water affinity, Rav is the reciprocal relaxation time of the polishing composition, and Rb is the It is the reciprocal of relaxation time of water, which is the solvent of the composition.) |