| abstract |
Provided are: a laminate which is provided with an organic semiconductor film, a water-soluble resin layer, and a photosensitive resin layer, and in which cracks do not readily form; and a kit. This laminate includes a water-soluble resin layer including a water-soluble resin, and a photosensitive resin layer including a photosensitive resin, which are provided in that order on an organic semiconductor film. The water-soluble resin layer and the photosensitive resin layer are adjacent to each other. The water-soluble resin is a polyvinylpyrrolidone having a weight average molecular weight of at least 300,000, and at least one polyvinyl alcohol having a weight average molecular weight of at least 15,000. The photosensitive resin has a weight average molecular weight of at least 30,000. |