http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200110425-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F212-22 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F212-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F20-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F212-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F20-28 |
| filingDate | 2019-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_efec79384bf676218eb6f3a1d98b8c42 |
| publicationDate | 2020-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20200110425-A |
| titleOfInvention | Photosensitive layer, laminate, photosensitive resin composition, kit |
| abstract | As a photosensitive layer included in a laminate having a water-soluble resin layer and a photosensitive layer, the photosensitive layer changes the dissolution rate of butyl acetate by the action of an acid-generating compound and an acid by irradiation with actinic rays or radiation. A resin formed of a photosensitive resin composition containing a resin and in which a change in dissolution rate for butyl acetate occurs due to the action of the acid has a weight average molecular weight of 10,000 to 50,000, and in the total structural unit, from 50 mol% to Dissolution rate when 100 mol% is a hydrophobic resin soluble in butyl acetate at 23°C in which a group soluble in an alkaline aqueous solution is protected by a hydrophobic protecting group, and the unirradiated photosensitive layer is immersed in butyl acetate at 23°C Is 20 nm/s or more and 200 nm/s or less, and a stop contact angle of the photosensitive resin composition on the aqueous solution resin layer is 60° or less. |
| priorityDate | 2018-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 378.