http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019163951-A1
Outgoing Links
Predicate | Object |
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classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F212-22 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F20-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F212-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F20-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F212-14 |
filingDate | 2019-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2021-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-WO2019163951-A1 |
titleOfInvention | Photosensitive layer, laminate, photosensitive resin composition, kit |
abstract | A photosensitive layer contained in a laminate having a water-soluble resin layer and a photosensitive layer, in which the dissolution rate of butyl acetate changes due to the action of a compound that generates acid by irradiation with active light or radiation and the acid. A resin formed from a photosensitive resin composition containing a resin and having a change in dissolution rate with respect to butyl acetate due to the action of the above acid has a weight average molecular weight of 10,000 to 50,000 and is a total constituent unit. Of these, 50 mol% to 100 mol% is a hydrophobic resin soluble in butyl acetate at 23 ° C. in which a unit soluble in an aqueous alkaline solution is protected by a hydrophobic protective group, and the above-mentioned photosensitive layer which has not been irradiated. The dissolution rate when immersed in butyl acetate at 23 ° C. is 20 nm / s or more and 200 nm / s or less, and the static contact angle of the photosensitive resin composition on the water-soluble resin layer is 60 ° or less. Photosensitive layer, laminate, photosensitive resin composition, kit. |
priorityDate | 2018-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 366.