| abstract |
The present invention addresses the problem of providing a photosensitive colored resin composition which has high sensitivity, and the function of absorbing visible light in a short wavelength region or the function of inhibiting reflection of external light, and is suitable for formation of a planarization film, an insulating layer, and a partition wall for use in an organic light emitting device or a display device, and a heat-resistance colored resin film of the composition. The photosensitive colored resin composition contains an alkali-soluble resin (a), a photosensitive compound (b), and a compound (c) having an absorption maximum in the wavelength range of not less than 400 nm but less than 490 nm. The photosensitive compound (b) contains a photosensitive compound (b1). The maximum absorption wavelength of the photosensitive compound (b1) within the wavelength range of 350-450 nm is within the wavelength range of 350-390 nm. |