abstract |
A positive electrode capable of forming a resin film having good adhesion during development and after heat treatment and having a good breakdown voltage after heat treatment even when the film thickness after heat treatment is 0.5 μm or less. Type photosensitive resin composition. (A) a precursor of a heat-resistant resin such as polyimide and polybenzoxazole and / or a resin having a ring-closing structural unit, (b) a quinonediazide compound, (c) an anthraquinone compound, an acenaphthene compound, an indole compound, A compound selected from the group consisting of a merocyanine compound and a styryl compound having an amino group, wherein the compound has an absorption maximum wavelength at a wavelength of 350 nm to less than 450 nm and does not have an absorption maximum wavelength at a wavelength of 450 nm to 700 nm and (d ) A positive photosensitive resin composition containing a solvent. [Selection figure] None |