http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I740998-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89afae566b725ae78e20cf972d9bcdc7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 |
| filingDate | 2017-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e69ec43649b8bd2c68cfa3c988bea9da |
| publicationDate | 2021-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I740998-B |
| titleOfInvention | Positive-type photosensitive resin composition, manufacturing method of metal wiring and laminate |
| abstract | The subject of the present invention is to provide: a positive photosensitive resin composition for forming an organic film that is used as an etching mask when a metal film is etched to form metal wiring, and in a cured state Used as a permanent film for covering the metal wiring formed by etching. The permanent film uniformly covers the entire surface of the metal wiring and does not cover the parts other than the metal wiring. The method of manufacturing metal wiring uses the positive photosensitive A resin composition, and a laminate, which have a permanent film and metal wiring formed by curing the positive photosensitive resin composition. Solution: The present invention uses the following positive photosensitive resin composition to form the patterned organic film, and the patterned organic film is used as an etching mask when the metal film is etched to form metal wiring, And in a cured state as a permanent film covering metal wiring formed by etching, the positive photosensitive resin composition contains (A) novolak resin, and (B) a compound containing a quinonediazide group , And (C) colorant. |
| priorityDate | 2016-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 326.