| abstract |
A curable organopolysiloxane composition including (A) a curing-reactive organopolysiloxane component obtained by curing or semi-curing reaction of at least two types of organopolysiloxanes in the presence of one type or two or more types of catalysts, and (B) a peroxide, the curable organopolysiloxane composition being non-fluid at 25°C and having a melt viscosity of 8000 Pa∙s or less at 100°C. The present invention provides a curable organopolysiloxane composition and an application for the same, the curable organopolysiloxane composition having hot-melt properties and curing in a short time, having excellent physical strength of the initial cured product thereof, and not being prone to cracking during curing, the resultant cured product having a small coefficient of thermal expansion, and the curable organopolysiloxane composition maintaining high physical strength even when exposed to high temperatures. |