| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_91f522a92924cb852bf4405566a6fb72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_334aee04cc8310d243d3fc88a540ab6a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_679fc7858d46067382eebecbd83c1596
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7bb1ac0effc475b4465efef5039e8c3f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5bf2742497f861cedc8a5d7a08b49650 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02337
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02348
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0234 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76826
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76825
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76814
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31 |
| filingDate |
2012-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b432e977cbcb71b97086ad06620be06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3afa055d326c659191b1abc3531903c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_edb6b32082272acde82a36e790833315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a3ea74459070b5d53550aed2c299c06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c4acffd411b0846bf98657f9b5329eb |
| publicationDate |
2012-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2012148641-A3 |
| titleOfInvention |
Uv assisted silylation for recovery and pore sealing of damaged low k films |
| abstract |
Methods for the repair of damaged low k films are provided. Damage to the low k films occurs during processing of the film such as during etching, ashing, and planarization. The processing of the low k film causes water to store in the pores of the film and further causes hydrophilic compounds to form in the low k film structure. Repair processes incorporating ultraviolet (UV) radiation and silylation compounds remove the water from the pores and further remove the hydrophilic compounds from the low k film structure. |
| priorityDate |
2011-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |