Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_334aee04cc8310d243d3fc88a540ab6a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_91f522a92924cb852bf4405566a6fb72 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_679fc7858d46067382eebecbd83c1596 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7bb1ac0effc475b4465efef5039e8c3f http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5bf2742497f861cedc8a5d7a08b49650 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02337 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0234 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02348 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76826 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76825 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76814 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31 |
filingDate |
2012-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b432e977cbcb71b97086ad06620be06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_edb6b32082272acde82a36e790833315 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3afa055d326c659191b1abc3531903c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c4acffd411b0846bf98657f9b5329eb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a3ea74459070b5d53550aed2c299c06 |
publicationDate |
2012-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2012148641-A2 |
titleOfInvention |
Uv assisted silylation for recovery and pore sealing of damaged low k films |
abstract |
Methods for the repair of damaged low k films are provided. Damage to the low k films occurs during processing of the film such as during etching, ashing, and planarization. The processing of the low k film causes water to store in the pores of the film and further causes hydrophilic compounds to form in the low k film structure. Repair processes incorporating ultraviolet (UV) radiation and silylation compounds remove the water from the pores and further remove the hydrophilic compounds from the low k film structure. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9660065-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015088666-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9966463-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021262542-A1 |
priorityDate |
2011-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |