Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_98814f30d21878126a7988d2a3f6fef5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_04ed45ce45e58f237cec7a815169254a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c15e62d56310375771d0179b9887a816 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0269 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0271 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
filingDate |
2011-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3103668c736cae04904ec945b84a7492 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bfea9725a17c66422d94cba6f7f147ee http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b6d6988dc11d8d61726e80796f9d09a |
publicationDate |
2011-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2011096385-A1 |
titleOfInvention |
Layered structure and light-sensitive dry film used in same |
abstract |
Provided is a layered structure that has, at least, a substrate (1) and a light-sensitive resin layer or cured coating layer (2), containing an inorganic filler (3), formed on top of the substrate. In the light-sensitive resin layer or cured coating layer, the proportion of the inorganic filler is lower in a surface region opposite the substrate than in other regions, making it possible to keep the coefficient of linear thermal expansion of the entire light-sensitive resin layer or cured coating layer as low as possible while also avoiding losses in resolution and achieving excellent adhesion to an underfill resin section or a molded resin section. Preferably, the light-sensitive resin layer or cured coating layer comprises at least two layers having different inorganic filler proportions, and the surface-side light-sensitive resin layer or cured coating layer opposite the substrate has a lower inorganic filler proportion than the other layer(s). A light-sensitive dry film containing the abovementioned light-sensitive resin layer is suitable for use as an interlayer resin insulation layer or a solder resist in a printed circuit board. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015064668-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016060137-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015014029-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2016060137-A1 |
priorityDate |
2010-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |