Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_44d4574c7bdaa41d2bf7c0d2f7595a00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10106 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 |
filingDate |
2012-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29db4d83c3d5812ba05c74f5598d7e70 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ed3182201b6f85e6ab6dd46d4bf4132 |
publicationDate |
2015-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2015014029-A1 |
titleOfInvention |
Photosensitive composition, hardened coating films therefrom, and printed wiring boards using same |
abstract |
Provided is a photosensitive composition, which comprises a carboxyl group-containing resin, a photopolymerization initiator, a photosensitive acrylate compound and a filler, wherein the filler has a refractive index of 1.5 to 1.6 and a dry coating film of the photosensitive composition shows an absorbance of at least either 0.01 to 0.2 at a wavelength of 365 nm or 0.01 to 0.2 at a wavelength of 405 nm per thickness of 25 μm. The content of the filler is preferably 20 to 60 wt % with respect to the total amount of the composition. This photosensitive composition can be advantageously used as a plating resist of a printed wiring board or a solder resist and is useful particularly in the formation of a very finely patterned resist film having a high aspect ratio. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018154678-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107430339-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10064292-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3279732-A4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10264720-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107531077-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017142828-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018046079-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10321560-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10712398-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10990010-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10182494-B1 |
priorityDate |
2011-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |